Product KCT with people and technology
- KNP301 / KNP302 / KNP304
- N2 Purge Kit
- ㆍDevice to prevent wafer contamination by discharging residual gas in wafer pattern through XCDA (N2) Purge in FOUP in semiconductor manufacturing process.
- ㆍPurge inside the FOUP to release O2 inside to prevent Natural Oxide Growing
ㆍWafer Size : 300mm Silicon Wafer
ㆍFOUP internal auto-purge is possible
ㆍRemoval of O2 inside FOUP (Natural oxide growth inhibition)
ㆍFDC Data Automation Software available
ㆍImprovement of semiconductor yield and productivity by preventing natural oxide growth and increasing run standby time
- Applied LPM: Brooks, TDK, etc ...
ㆍHumidity & Temp. Monitoring
ㆍLoad Port Configuration
- 300mm LPM(1~4Foup)